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 Philips Semiconductors
Product specification
Three quadrant triacs high commutation
GENERAL DESCRIPTION
Glass passivated high commutation triacs in a plastic envelope suitable for surface mounting, intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. These devices will commutate the full rated rms current at the maximum rated junction temperature, without the aid of a snubber.
BTA225B series B
QUICK REFERENCE DATA
SYMBOL VDRM IT(RMS) ITSM PARAMETER BTA225BRepetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current MAX. MAX. MAX. UNIT 500B 500 25 180 600B 600 25 180 800B 800 25 180 V A A
PINNING - SOT404
PIN 1 2 3 mb DESCRIPTION main terminal 1 main terminal 2 gate main terminal 2
PIN CONFIGURATION
mb
SYMBOL
T2
2 1 3
T1
G
LIMITING VALUES
Limiting values in accordance with the Absolute Maximum System (IEC 134). SYMBOL PARAMETER VDRM IT(RMS) ITSM Repetitive peak off-state voltages RMS on-state current Non-repetitive peak on-state current full sine wave; Tmb 91 C full sine wave; Tj = 25 C prior to surge t = 20 ms t = 16.7 ms t = 10 ms ITM = 30 A; IG = 0.2 A; dIG/dt = 0.2 A/s CONDITIONS MIN. -500 5001 MAX. -600 6001 25 -800 800 UNIT V A
-
I2t dIT/dt IGM VGM PGM PG(AV) Tstg Tj
I2t for fusing Repetitive rate of rise of on-state current after triggering Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature
190 209 180 100 2 5 5 0.5 150 125
A A A2s A/s A V W W C C
over any 20 ms period
-40 -
1 Although not recommended, off-state voltages up to 800V may be applied without damage, but the triac may switch to the on-state. The rate of rise of current should not exceed 15 A/s. September 1997 1 Rev 1.100
Philips Semiconductors
Product specification
Three quadrant triacs high commutation
THERMAL RESISTANCES
SYMBOL Rth j-mb Rth j-a PARAMETER CONDITIONS
BTA225B series B
MIN. -
TYP. 55
MAX. 1.0 1.4 -
UNIT K/W K/W K/W
Thermal resistance full cycle junction to mounting base half cycle Thermal resistance minimum footprint, FR4 board junction to ambient
STATIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL IGT PARAMETER Gate trigger current
2
CONDITIONS VD = 12 V; IT = 0.1 A T2+ G+ T2+ GT2- GT2+ G+ T2+ GT2- G-
MIN. 2 2 2 0.25 -
TYP. 18 21 34 31 34 30 31 1.2 0.7 0.4 0.1
MAX. 50 50 50 60 90 60 60 1.55 1.5 0.5
UNIT mA mA mA mA mA mA mA V V V mA
IL
Latching current
VD = 12 V; IGT = 0.1 A
IH VT VGT ID
Holding current On-state voltage Gate trigger voltage Off-state leakage current
VD = 12 V; IGT = 0.1 A IT = 30 A VD = 12 V; IT = 0.1 A VD = 400 V; IT = 0.1 A; Tj = 125 C VD = VDRM(max); Tj = 125 C
DYNAMIC CHARACTERISTICS
Tj = 25 C unless otherwise stated SYMBOL dVD/dt dIcom/dt tgt PARAMETER Critical rate of rise of off-state voltage Critical rate of change of commutating current Gate controlled turn-on time CONDITIONS VDM = 67% VDRM(max); Tj = 125 C; exponential waveform; gate open circuit VDM = 400 V; Tj = 125 C; IT(RMS) = 25 A; without snubber; gate open circuit ITM = 30 A; VD = VDRM(max); IG = 0.1 A; dIG/dt = 5 A/s MIN. 1000 TYP. 4000 44 2 MAX. UNIT V/s A/ms s
2 Device does not trigger in the T2-, G+ quadrant. September 1997 2 Rev 1.100
Philips Semiconductors
Product specification
Three quadrant triacs high commutation
BTA225B series B
40
Ptot / W
BTA140
Tmb(max) / C
85
30 25
IT(RMS) / A
BTA140 91 C
= 180 30
1
120 90 60
95
20
105
20
30
15 10
10
115
5
0 125 30
0
5
10
15 IT(RMS) / A
20
25
0 -50
0
50 Tmb / C
100
150
Fig.1. Maximum on-state dissipation, Ptot, versus rms on-state current, IT(RMS), where = conduction angle.
ITSM / A BTA225
Fig.4. Maximum permissible rms current IT(RMS) , versus mounting base temperature Tmb.
IT(RMS) / A BTA140
1000
50
40
dI T /dt limit 100
30
20
IT T 10 10us I TSM time
10
Tj initial = 25 C max 100us 1ms T/s 10ms 100ms
0 0.01
0.1 1 surge duration / s
10
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width tp, for sinusoidal currents, tp 20ms.
ITSM / A BTA140 IT 150 T ITSM time
Fig.5. Maximum permissible repetitive rms on-state current IT(RMS), versus surge duration, for sinusoidal currents, f = 50 Hz; Tmb 91C.
VGT(Tj) VGT(25 C)
200
1.6 1.4 1.2 1 0.8
BT136
Tj initial = 25 C max 100
50
0.6
0
1
10 100 Number of cycles at 50Hz
1000
0.4 -50
0
50 Tj / C
100
150
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number of cycles, for sinusoidal currents, f = 50 Hz.
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25C), versus junction temperature Tj.
September 1997
3
Rev 1.100
Philips Semiconductors
Product specification
Three quadrant triacs high commutation
BTA225B series B
3 2.5 2 1.5 1
IGT(Tj) IGT(25 C)
BTA216 T2+ G+ T2+ GT2- G-
80 70
IT / A Tj = 125 C Tj = 25 C
BTA140
60 Vo = 1.073 V
Rs = 0.015 ohms
typ
max
50 40 30 20
0.5 0 -50
10
0
50 Tj / C
100
150
0
0
0.5
1
1.5 VT / V
2
2.5
3
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25C), versus junction temperature Tj.
IL(Tj) IL(25 C)
Fig.10. Typical and maximum on-state characteristic.
3 2.5 2 1.5 1
TRIAC
10
Zth j-mb (K/W)
BTA140
1
unidirectional bidirectional
0.1
P D tp
0.01
0.5 0 -50
0.001 10us 0.1ms 1ms 10ms tp / s 0.1s 1s
t
0
50 Tj / C
100
150
10s
Fig.8. Normalised latching current IL(Tj)/ IL(25C), versus junction temperature Tj.
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance Zth j-mb, versus pulse width tp.
3 2.5 2 1.5 1 0.5
TRIAC
1000
dIcom/dt (A/ms)
BTA225
100
10
0 -50
0
50 Tj / C
100
150
1 20
40
60
80 Tj / C
100
120
140
Fig.9. Normalised holding current IH(Tj)/ IH(25C), versus junction temperature Tj.
Fig.12. Typical, critical rate of change of commutating current dIcom/dt versus junction temperature.
September 1997
4
Rev 1.100
Philips Semiconductors
Product specification
Three quadrant triacs high commutation
MECHANICAL DATA
Dimensions in mm Net Mass: 1.4 g
10.3 max 4.5 max 1.4 max
BTA225B series B
11 max 15.4
2.5 0.85 max (x2) 2.54 (x2)
0.5
Fig.13. SOT404 : centre pin connected to mounting base.
Notes 1. Epoxy meets UL94 V0 at 1/8".
MOUNTING INSTRUCTIONS
Dimensions in mm
11.5
9.0
17.5 2.0
3.8
5.08
Fig.14. SOT404 : minimum pad sizes for surface mounting.
Notes 1. Plastic meets UL94 V0 at 1/8".
September 1997
5
Rev 1.100
Philips Semiconductors
Product specification
Three quadrant triacs high commutation
DEFINITIONS
Data sheet status Objective specification Product specification Limiting values
BTA225B series B
This data sheet contains target or goal specifications for product development. This data sheet contains final product specifications.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of this specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. (c) Philips Electronics N.V. 1997 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, it is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices or systems where malfunction of these products can be reasonably expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
September 1997
6
Rev 1.100


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